Safety Precautions When Using Soldering Iron
OPERATIONAL SAFETY CHECKS

  1. Do not plug in and turn on until the tip element has been checked, or replaced and tightened.
  2. Never touch the soldering tip.
  3. Always wear safety glasses.
  4. Avoid positioning your head directly over the soldering process.
  5. Avoid prolonged use.

Meer items

What is the safety precaution of soldering iron?

Safety Precautions 1) Soldering Iron Safety Never touch the element or tip of the soldering iron. It is very hot (about 400°C) and will burn. Hold wires to be heated with tweezers, pliers or clamps to avoid receiving burns from objects that are heated. Keep the cleaning sponge wet during use.

What are the hazards of using a soldering iron?

Last Updated: January 3, 2022 4:07:26 PM PST Learn about lead soldering safety. Workers can be exposed to lead during soldering. If handled incorrectly, lead can pose chronic health effects, such as reproductive problems, digestive problems, memory and concentration problems, and muscle and joint pain. Potential exposure routes:

Ingestion Inhalation

Soldering with lead (or other metals used in soldering) can produce dust and fumes that are hazardous. In addition, using flux containing rosin produces solder fumes that, if inhaled, can result in occupational asthma or worsen existing asthmatic conditions; as well as cause eye and upper respiratory tract irritation.

What are the risk assessment for using a soldering iron?

Fumes from rosin-based flux can cause respiratory sensitization. Hot soldering iron tips can cause burns to skin. Splashes of flux and solder can cause burns to skin and either temporary or permanent eye damage. Small butane cartridge soldering irons present a high risk in the hands of students.

Should I wear a mask when soldering?

Inhalation of flux fumes during soldering may cause irritation and damage of mucous membranes and respiratory system. Eyes may become irritated from contact with smoke from soldering. Respiratory Protection: When ventilation is not sufficient, A NIOSH approved respirator should be worn.

What are 3 important considerations when soldering components?

General Soldering Information Cleaning A good soldering technician observes the following stages of preparation for each job.

  1. Cleaning all components, circuit boards, tools, and materials to be used for the soldering process.
  2. Selecting the flux.
  3. Determining the heat to be used and the length of time to do the job, which are based on the thermal mass of the parts to be connected.
  4. Selecting the solder.
  5. Choosing the flux remover.

Ask an experienced soldering technician, “What is the most important task to perform before soldering?” Many technicians, even those who have been soldering for years, will probably answer, “heat,” “iron tip,” “solder.” They usually miss the most critical task of all: cleaning.

Clean the soldering iron tip, component lead or wire, the item that the component is being soldered to (board or terminal), tools being used to form the wires/leads, and even the solder itself. Cleaning the Soldering Tip The soldering iron tip should be bright silver with no flux residue or solder on it.

Any major buildup of oxide on the tip is removed by wiping the tip on a damp sponge before applying it to the area to be soldered. This shocking action steams off the oxide and leaves the tip pristine and in the proper condition for soldering. To start, you need the correct soldering iron for the job.

  • For the majority of electronics work, this means a 25-to-30-watt pencil type iron with variable heat control.
  • This makes is easy to ensure that the proper temperature is used for the work at hand.
  • Soldering guns or irons with magnetically controlled heaters can possibly damage the very tiny and sensitive integrated circuits or ICs because of the electromagnetic fields radiating from these types of irons.

Tip Maintenance If a soldering iron does not have a thin consistent layer or solder over the entire surface, the tip has not been properly tinned. If the iron tips is not properly tinned, start with a cold iron, turn the heat on, and hold the flux cored wire solder against the tip as it heats up.

Wipe off the excess solder, then shock the tip on the sponge before soldering. Do not wipe the excess solder, burned flux residue, and other contaminants onto the sponge. The purpose of the sponge is to shock the iron. If you keep dumping your excess solder, burned flux, and other residue onto your sponge, the sponge quickly becomes useless.

Every time you then touch the sponge, you pick up the dirt you put there earlier. This adds contamination to the solder connection. The sponge should remove the thin layer or oxide that builds up when the iron is heated. Find another means and another place to remove the dirt from your iron.

  1. One method is to use a paper or cotton wipe, ones that will not be shred and leave particles behind, and very gently wipe the dirt from your iron.
  2. Then shock the iron tip to touching the dampened sponge.
  3. Some solder stations now have sponges with openings in the middle that allow you to wipe the excess solder off into the opening leaving the sponge free of contaminants that would otherwise end up on the tip of the iron.

(Practical Hint: When you are not using your iron, make sure you leave a large lump of solder on the tip. This maintains the tinning on the tip, and the tip will last much longer. Many technicians mistakenly clean the tip before they put the iron into the holder.

  1. Leave the solder on the tip to protect it.) Board Cleaning In a manufacturing facility, a relatively clean board is generally available, but this should not be taken for granted.
  2. If boards have been stored without protection against oxides and other airborne contaminants, cleaning may be required before you do any soldering.

Wire terminals may need to be pre-tinned to remove oxides before a wire is installed. Dirt films on metals may consist not only of oxides, but sulfides, carbonates, and other corrosive materials from the environment. These will hinder solder flow or wetting of the solder onto the surfaces being soldered.

  1. Component Leads and Wire Cleaning Component leads should be tested periodically for solderability.
  2. Take items from stock at random and test them to ensure that problems will not be encountered when components are installed onto the board.
  3. If necessary, re-tin the leads, then clean them off.
  4. Wire, tinned by hand or solder pot, should have the burned flux residue removed.

If this residue is not removed, this contaminating material will be included in an unreliable connection. Clean the wire with a liquid cleaner. Items such as a pink eraser, steel wool or similar types of cleaning tools are not a good idea. The eraser leaves a gum residue which you now have to remove and the steel wool could actually remove the tinning, ect.

  1. Some technicians feel that the heat of the soldering iron cleans off the area to be soldered.
  2. This is a very common misconception.
  3. Some of the techniques used actually increase the oxidation rate.
  4. Make sure everything you use or solder is clean.
  5. Flux A second very important item in preparing to solder is the flux.

Flux has a very definite purpose: It prevents oxidation and removes the thin layer of oxide and the atmosphere gas layer from the area to be soldered. When the flux is applied to the area, it permits the solder to flow, or wet, smoothly and evenly over the surface of the lead, wire, or pad being soldered.

It also improves the flow of heat, resulting in faster heating of the items are area being soldered. Types of Flux There are various types of fluxes available. (Caution: Some types of flux should never be used on a circuit board because they corrode the board and the lead parts if the flux is not removed immediately.

Acid- or zinc-based fluxes should not be used on a circuit board. Fully activated rosin flux, known as RA, also is not recommended for use on a circuit board.) The acceptable types of rosin flux include the pure rosin and the mildly activated rosin (R or RMA).

This later flux is in common use today, with some inroads being made by so-called low residue and no clean fluxes. It has been found that some residues left behind from flux becomes water absorbent and should be removed within a maximum or thirty minutes after the connection has been made. RA flux is acceptable for use in tinning bus wire or component leads, but should not be used on a circuit board or even kept in the same room, in case it gets picked up and used by mistake.

Activators will degrade the board and cause problems that would otherwise not occur. Most boards operate in an enclosed environment where there is considerable heat, moisture (relative humidity), airborne bits and pieces or dirt. The environment softens the flux left on the board, turning it into a gooey, particle-attracting, water-absorbing blob or useless material.

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This mess will become conductive as it absorbs moisture, resulting in leakage paths that cause problems in the operation of the equipment. In late 1992, a new water-soluble flux, developed originally by Huges Aircraft, received acceptance: final approval for its use was made in early 1993. The flux is made from lemons.

This makes it very easy to clean, but the cleaning must be very thorough, or residue may cause corrosion. Wetting If the correct flux is properly used, it will greatly assist all aspects of soldering and desoldering. It improves the intermetallic bonding and consequently the solder flow, which is one of the important areas of inspection.

  1. Poor wetting is usually the result of poor cleaning procedures or lack of sufficient heat.
  2. De-wetting problems relate to the material that is being soldered as a result of the intermetallic compound reaching the surface of the tinned area.
  3. The feathering out of the solder on a connection indicates that wetting has occurred.

Heat, Time, Mass The third item in preparing to solder includes three very important factors to be considered. These are the heat to be used, time on the connection, and the mass of the joint. Because not all connections are the same, consideration must be given to the differences in the mass of the joints and adjusting the heat and/or time accordingly.

You should not use the same heat and length of time to solder a diode to a small pad as would be needed for soldering a wire onto a terminal. The diode would be would be damaged, the pad area where the lead is being soldered could be damaged, and the solder will be overheated. An iron that is too cold will result in a mush type of melt and poor wetting action.

The maximum time from when a soldering iron comes into contact with the parts that are to be connected until the joint is finished should not exceed two to five seconds. In some cases just one second is the maximum allowable time. One other thing to keep in mind as far as heat is concerned is the oxidation rate of the soldering iron tip.

At a normal temperature of 600 degrees, there is a certain amount of oxidation produced, depending on the time it is left unused and without any solder on the tip. At 700 degrees the rate is nearly ten times the level of oxidation and at 800, approximately hundred times. This oxidation acts as a barrier to the transfer of heat and therefore the proper flow of solder.

Because we are not robots and because people work and react differently to what is happening, it is beneficial for personnel to be able to easily regulate the amount of heat being applied. Changing the heat of the tip of the iron should be the simplest task possible; for example, turning a dial.

People should be able to recognize what is actually occurring as compared to what they feel is going on. Experienced solders have a genuine knowledge of what happened to a particular joint. They know by observing what has happened and can judge whether a joint will be reliable or will break down in a short period of time.

To inspect solder connections, a 10X stereo microscope should be made available for managers and supervisors. They should also be trained to know what they should see during inspection. Solder Types The fourth point in preparing to solder is to consider the type of solder to be used.

Most companies and technicians use 60/40 solder. There is nothing wrong with 60/40 solder, but there is a better one- 63/37 or eutectic solder. Note that for the 60/40 solder, there is a time when the solder is neither liquid nor solid. It is in a plastic state during this period. It is very important that there be absolutely no vibration or movement of the connection when the solder is going through this plastic region, otherwise a disturbed joint will be the result.

The 63/37 solder has no plastic period and reduces the possibility of a disturbed connection. Heat Sinking Heat sinking is a method used to prevent the overheating of components, wires, or circuit boards. It usually is a small metal clip or clamp which is attached to the area between where the solder connection will be made and the item to be protected.

The use of a heat sink for soldering some components is not required if the proper technique for soldering is followed to the letter. However, if the proper soldering technique is not followed, heat sinking becomes an alternative, but not a good one. Heat sinking is used mostly by persons who are unaware of the proper procedures.

Compensation has to be made for the additional mass of the heat sink by increasing the heat and possibly the length of time. If this concerns a diode in a double-sided board in a plated through hole will a small pad area on each side, the chances of lifting a pad becomes greater by the millisecond.

The heat sink would have to be placed on the top of the circuit board attached to one of the leads. Because the solder and iron are on the bottom of the board, it will be difficult to get the solder to flow throughout the hole and wet onto the component side pad – which is what should happen for the lead to be soldered correctly.

Cleaners and/or Flux Removers Item five is preparing to solder involves the selection of a good chemical cleaner. When it comes to the cleaner to be used for removing flux and cleaning in general, there is a wide variety of cleaners from which to choose.

The cleaner must be able to remove ionic and non-ionic residue from anything that is being, or has been soldered. Check the contents of the cleaner, then check the Material Safety Data Sheet (MSDS) for information on the various chemicals involved. See if anything in the cleaner is carcinogenic (cancer causing).

Even if carcinogens are present in only small quantities, you should try something else. Isopropyl alcohol (IPA), also known as isopropanol, is a decent cleaner; but there are others that contain blends of alcohol that are even better. The key is to find a cleaner that will not harm your work or – more importantly – yourself.

  1. Soldering Techniques Various techniques have been tried ever since soldering was first used in electronics.
  2. The old saying “the bigger the blob, the better the job” can no longer be accepted.
  3. What was considered too meticulous and fussy is now the standard.
  4. Soldering can no longer be taken for granted.

It is an art, and there are very few gifted painters. In 1989 a person who received two weeks of formal soldering training in 1981 said, “Soldering sure has changed in eight years!” This comment underscores the need for training from knowledgeable instructors who keep up-to-date with soldering techniques.

The usual soldering technique is as follows: First apply the solder to the tip of the iron, then apply the iron to the area to be soldered. If the flux is not put onto the lead and pad first, the purpose of the flux in the wire solder is defeated. The flux dissipates over the iron tip and turns into carbon pieces rather than going onto the lead and pad to remove the oxides.

So much for a clean, oxide-fee surface; so much for the wetting action; and so much for a good, reliable, problem-free connection. Solder Application There are a few exceptions, but the following is a tried and proven technique. Believe it or not, it has been known for decades.

  1. Before the iron is applied, solder of the proper size is placed beside the lead or wire and on the pad area or terminal to be soldered. A clean iron is applied, and no pressure is exerted on the area being soldered. Only contact with both surfaces is required.
  2. The proper iron tip – clean, oxide-free, and heated to the correct temperature – is brought to where the solder has been placed, commonly referred to as the “point of maximum thermal mass.” As soon as the hot iron touches the solder, the solder melts, permitting the flux in the wire solder to clean off the surface, as well as creating a solder or heat bridge that heats up the joint area very quickly.
  3. The wire solder is now moved to the opposite side of the lead or wire, and the proper amount of solder needed to complete the connection is added. In either case the exposed copper end of the lead or wire must be sealed by solder to prevent oxidation of the copper, which occurs very rapidly. How do you know if you have the right amount? If the solder is concave and has an angle of wetting between 0 and 20 degrees, it could be a good connection.
  4. For double-sided and multilayered boards this is the required technique, to ensure that solder has gone through the board onto the component side and wetted the appropriate area on that side. If this technique is not used, the chances of the solder flowing to the component side, without excessive heat being applied, are from very poor to none. Solder should only be applied to the solder side. The solder fillet on the component side of the double-sided or multi-layered boards is never applied on the component side. Some technicians might have learned that the best soldering method is to apply the iron to the item being soldered and then to add the solder. This method can reduce your chances of making a good connection in two ways:
    1. When heat is applied to any metal, the metal oxidizes at a very rapid rate. The higher the heat, the faster the oxidation. This oxidation creates an insulating barrier that will not allow the solder to flow easily into the surfaces being soldered, thereby preventing good wetting action needed.
    2. Flux in the wire cored solder should remove the surface gasses and oxides from the surfaces being soldered. If the solder is applied after the iron, the overheated flux becomes small pieces of carbon-type material that sit on the soldering iron. The flux never gets to do what it is supposed to do. Worse still, it flows into the connection area, causing the joint to become contaminated – a poor connection.
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By applying the solder before the iron, you make proper use of the available flux and form a heat or solder bridge. This technique heats up the surface faster and allows you to complete the job properly in the shortest possible time. As you reduce the amount of time needed to do the job, you also reduce the probability of board damage due to excessive heat and time.

Amount of Solder When soldering a joint, it is not how much solder is added but the technique used to make the joint. Very little solder is needed in most cases. Usually about one-half to one-third of what is usually considered necessary is all the solder needed. The larger the blob of solder, the more difficult it is to determine if proper wetting of the soldered surfaces has taken place.

Reflow Soldering A second method of soldering is referred to as reflow soldering. This is normally used where plated through holes are not involved, such as the installation of surface mount items or repairing circuit board traces. The technique is relatively simple.

  • Overheated – de-wetting; lumps; dull; crystalline-like; looks as though sand has been thrown into the joint.
  • Cold – poor wetting; stretch marks between the pad and lead.
  • Fractured – poor wetting; stretch marks between the pad and lead.
  • Non-wetting – solder balled up around the joint.
  • Excessive solder – lead or wire contour is not visible and the shape of the solder is convex.
  • Insufficient solder – hole is not covered; copper end is not sealed; it is not as wide as the wire or lead.
  • De-wetting – usually excessive heat; solder balls up. This also occurs if an intermetallic compound is involved.

Other defects to watch for include:

  • Pinholes or voids – from dust, dirt, flux gas, improper heat, or other contamination.
  • Lumps and large holes – improper presoldering cleaning and outgassing from flux gas.
  • Damaged wire insulation – excess heat and/or wicking of solder under the wire insulation.

Characteristics Of A Good Connection A good solder joint has very few things to look for compared to a poor one. A good solder joint shows the following characteristics:

  • Smooth
  • Bright
  • Shiny
  • Clean
  • Concave solder fillet
  • Good wetting
  • The end of the wire or lead covered with solder

“Do it once and do it right” should become the standard for soldering personnel. They should be very familiar with this and be able to apply it to their work. Doing the job right the first time eliminates the need for costly rework, equipment returned by the customer, the purchase of rework and test equipment, and the hiring of someone to do the work.

Is solder toxic to touch?

Health risks from lead-based solder: When heated, lead forms lead oxide fumes. Lead is absorbed into the bloodstream through the mucous membranes of the skin, the lungs, and the stomach. If lead enters the body, it can give rise to serious chronic health effects.

Although many manufacturers are making adjustments to move to non-lead solder, it has not yet been completely eliminated from the industry. If you are using solder that contains lead, it can cause contamination and subsequent illness. For this reason, you should find out whether or not your solder contains lead and if there is a non-lead alternative available.

The most common way for lead to enter your body when soldering is through ingestion. This usually happens when the surfaces where you are working are contaminated with lead dust. Although touching the lead is not harmful to your skin, it can enter your body if you smoke, eat, drink, etc., without first washing your hands.

  1. If the solder contains lead, the melting process can release fumes that contain toxic lead oxide fumes.
  2. Inhaling the fumes can add to lead accumulation in the body which can cause both acute and long term illness.
  3. Ideally, wherever possible, you should switch from a lead solder to a lead-free (and rosin-free) solder (or look at a different joining solution).

Rosin (colophony and resin) can often be contained in solder flux. The fumes generated from using rosin can cause eye, throat and lung irritation, headaches and nosebleeds. Rosin is also a skin sensitiser and can cause and aggravate asthma. It is therefore important to read the Safety Data Sheet that is available to you when deciding on which solder wire to use for your work, so that you can tell what is contained within the solder fume that becomes liberated when you are soldering.

  • When changing to lead-free and rosin-free solder is not practicable, which may be because you are working on or repairing old electronic components, then it is imperative that you justify this within your risk assessment and that you work safely.
  • Good personal hygiene and having access to facilities where you can wash your hands is vital, as too is use of proper local exhaust ventilation, like a booth, or if needing to be portable, on-tip extraction, that is purposely designed for removing solder fume through either a filtration unit, or ideally out to a place of safety.

Where these systems are installed or used, they need to be used as per the manufacturer’s instructions and will require regular maintenance to ensure they remain effective. This includes changing the filters as per the replacement schedule and regular cleaning.

Records must be maintained as per any other LEV system (by completion of the log book). Extraction used for soldering fume also requires statutory testing every 14 calendar months under the Control of Substances Hazardous to Health Regulations, so if purchased, will need to be added to your statutory testing register.

Supervisors/line managers should inform users of the risks from soldering and be instructed on how to solder, bringing to their attention other risks that are relevant and specific to soldering, including risk of burns, electric shock, fire, etc. if rules are not adhered to.

What to do and not to do after soldering?

Keep the Tip Clean – During soldering, it’s natural for the iron plating on the tip to oxidize and form an iron oxide layer. This oxidized layer hinders heat transfer from the tip to the pads, which is why some joints never seem to melt no matter how much you turn up the heat. A gunky soldering iron tip(Source: Metcal) Maintaining the habit of keeping your soldering iron tip clean before, during, and after use will extend the life of the soldering tip. And if you are using a shared soldering iron at your school or workplace, where dirty irons are commonplace, it helps to know how to deal with the material buildup on the tip. It’s common for soldering stands to come with a spot for sponges You can also opt to use a brass or stainless steel wool. Brass wool is softer while stainless has a longer life. Using brass wool is a popular way to clean soldering tips, as it gently scrubs the tip without damaging the iron plating on the tip. Brass wool in a little pot If the solder tip does become oxidized, apply flux-core solder to the oxidized tip. Heat from the solder tip will activate the flux and start the chemical reaction that removes oxides. After soldering, immediately coat the tip in fresh solder to prevent oxidation.

Why is soldering illegal?

Legislative History – In 1986 Congress Amended the Safe Drinking Water Act, prohibiting the use of pipes, solder or flux that were not “lead free” in public water systems or plumbing in facilities providing water for human consumption. At the time “lead free” was defined as solder and flux with no more than 0.2% lead and pipes with no more than 8%.

  • In 1996 Congress further amended the Safe Drinking Water Act, requiring plumbing fittings and fixtures (endpoint devices) to be in compliance with voluntary lead leaching standards.
  • The amendments also prohibited the introduction into commerce of any pipe, pipe or plumbing fitting or fixture that is not lead free.
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In 2011 Congress passed the Reduction of Lead in Drinking Water Act (RLDWA) revising the definition of lead free by lowering the maximum lead content of the wetted surfaces of plumbing products (such as pipes, pipe fittings, plumbing fittings and fixtures) from 8% to a weighted average of 0.25%, establishing a statutory method for the calculation of lead content and eliminating the requirement that lead free products be in compliance with voluntary standards established in accordance with SDWA 1417(e) for leaching of lead from new plumbing fittings and fixtures.

The 2011 RLDWA also created exemptions in SDWA Section 1417 from the prohibitions on the use or introduction into commerce of “pipes, pipe fittings, plumbing fittings or fixtures, including backflow preventers, that are used exclusively for non-potable services such as manufacturing, industrial processing, irrigation, outdoor watering, or any other uses where the water is not anticipated to be used for human consumption” (SDWA 1417(a)(4)(A)).

Also exempt are “toilets, bidets, urinals, fill valves, flushometer valves, tub fillers, shower valves, service saddles, or water distribution main gate valves that are 2 inches in diameter or larger” (SDWA 1417(a)(4)(B)). The Community Fire Safety Act of 2013 further amended the SDWA Section 1417 to include fire hydrants in the list of exempted plumbing devices.

Are soldering irons a fire hazard?

Fire The heat generated by the soldering iron is enough to start a fire. Soldering should never occur in the immediate vicinity of flammable gases or liquids.

What is the toxic material in solder?

Poisonous Ingredient The substances in solder that can be harmful are: Antimony. Bismuth. Cadmium.

What are the failures in soldering?

Examples of common soldering failures|HIKARU’S DIARY ON LEARNING TO SOLDER |HAKKO | HAKKO Corporation Because a flux film is present between the metals to be joined (for example, between a wire and a terminal), the metals are not electrically connected with each other. This is the most common failure. In general, conditions of soldering finish with a rough surface and no brightness are called “Cold-Joint”. This failure degrades the joint strength, causing the jointed parts to come off when they are exposed to impact or vibration. This failure indicates the condition that solder does not thoroughly spread over the wire/lead and the wire/lead is partially exposed. This failure frequently occurs in the case where the wire/lead or terminal surface is dirty or oxidized, or exposed to uneven heat application, or where the amount of heat is not enough to solder. This failure indicates the condition that solder spreads over the terminal excessively. This failure frequently occurs in the case where the heating time is too long or when applying solder too much. Solder drop will not cause a particularly serious problem. However, if it causes a short-circuit between terminals, it will result in a critical failure. For soldering, we must clean the parts to be jointed, put the soldering iron at an appropriate position, apply heat for an appropriate time, and feed appropriate amount of solder. When large and small metal pieces are compared, it is natural that the small metal piece is heated earlier than the large one.

  • Furthermore, solder will flow to a part at a higher temperature because of its characteristic.
  • To do soldering well, we must make use of this characteristic.
  • Thermal conductivity is considerably improved by feeding a small amount of solder to the soldering tip.
  • Soldering usually cannot be done well the first time.

Try to solder many times and you can improve your skill by trial and error. : Examples of common soldering failures|HIKARU’S DIARY ON LEARNING TO SOLDER |HAKKO | HAKKO Corporation

What are 3 safety rules when using an iron?

Using your iron safely –

Never leave your iron unattended. Unplug when not in use. Don’t wrap the supply cable around the iron while it is cooling down. Ideally, use an iron caddy to place your iron on as it cools down after use. If you don’t have one, make sure that it is not near to flammable materials and out of reach of small children and pets Keep out of reach of small children and pets at all times – do not allow them to pull on the wires or hang on the ironing board. Check cords and plugs for signs of damage on a regular basis. Discontinue use if there are any signs of damage present. If you drop your iron it is important that it is checked for safety before using it again as wires inside the appliance may have become loose. Discontinue use if the case around the appliance becomes broken and wires are exposed.

: Irons: Steam, Cordless, Steam Generator & Travel Irons

What PPE should be worn when soldering?

Protective Clothing – To prevent burns from splashes or hot solder, long sleeve shirts and pants should be worn. Closed-toed shoes are required in all OSU lab spaces. Eye protection – Safety glasses, goggles, or face shields must be worn when soldering and clipping wires. Lead soldering waste is considered hazardous.

What mask should I wear when soldering?

NIOSH approved for at least 95% percent filtration efficiency against certain non-oil based particles Recommended for welding and operations in which metal fumes may be present Cake resistant filter layers reduce the caking of particles on the respirator surface View more details MSRP $89.84 per Box (10 EA) $718.69 per Case (8 Box) Other quantities may be available View buying options

NIOSH approved for at least 95% percent filtration efficiency against certain non-oil based particlesRecommended for welding and operations in which metal fumes may be presentCake resistant filter layers reduce the caking of particles on the respirator surfaceAdjustable noseclip helps provide a custom secure sealFeatures the 3M™ Cool Flow™ ValveAdvanced Electret Media is designed for ease of breathing

This disposable N95 particulate welding respirator is designed to help provide respiratory protection for applications such as welding or soldering where metal fumes may be present. Features 3M™ Cool Flow™ Valve, foam faceseal, adjustable head straps.3M™ Particulate Respirator 8212, N95 is a disposable particulate respirator that is designed to help provide reliable respiratory protection for applications such as welding or soldering where metal fumes may be present.

  1. This welding respirator provides at least 95 percent filtration efficiency against certain non oil based particles.
  2. Cake resistant filter layers reduce the caking of particles on the respirator surface.
  3. Soft inner material provides added comfort while the cup shape design makes the respirator spacious and durable.

Adjustable noseclip helps provide a custom secure seal. Fully adjustable head straps help provide a comfortable and secure seal. This respirator is compatible with a variety of protective eyewear and hearing protection. Recommended applications include welding, torch cutting, brazing, soldering, and metal pouring.

  • Fitted with a 3M Cool Flow™ Exhalation Valve, this respirator helps release warm and moist exhaled breath from inside the respirator.
  • This particulate respirator is NIOSH (National Institute for Occupational Safety and Health) approved for environments containing certain non oil based particles and provides P95 (95%) filter efficiency.

The respirator is also flame resistant as demonstrated per modified ASTM D2859 (not a substitute for a faceshield). Breathing hazardous particles can pose a risk to your health. NIOSH, a Federal government regulatory agency, has tested and approved the 3M Particulate Welding Respirator 8212, which is designed to help reduce exposure to certain airborne particles.

Is it safe to solder without gloves?

Working with solder, flux and cleaners: Always wear eye protection to avoid solder debris. Wear gloves while soldering and wash hands with soap and water after removing gloves. Keeping cleaning solvents like flux cleaner and iso-propyl alcohol in dispensing bottles to avoid inhalation hazards.

Are soldering irons a fire hazard?

Fire The heat generated by the soldering iron is enough to start a fire. Soldering should never occur in the immediate vicinity of flammable gases or liquids.

What to do and not to do after soldering?

Keep the Tip Clean – During soldering, it’s natural for the iron plating on the tip to oxidize and form an iron oxide layer. This oxidized layer hinders heat transfer from the tip to the pads, which is why some joints never seem to melt no matter how much you turn up the heat. A gunky soldering iron tip(Source: Metcal) Maintaining the habit of keeping your soldering iron tip clean before, during, and after use will extend the life of the soldering tip. And if you are using a shared soldering iron at your school or workplace, where dirty irons are commonplace, it helps to know how to deal with the material buildup on the tip. It’s common for soldering stands to come with a spot for sponges You can also opt to use a brass or stainless steel wool. Brass wool is softer while stainless has a longer life. Using brass wool is a popular way to clean soldering tips, as it gently scrubs the tip without damaging the iron plating on the tip. Brass wool in a little pot If the solder tip does become oxidized, apply flux-core solder to the oxidized tip. Heat from the solder tip will activate the flux and start the chemical reaction that removes oxides. After soldering, immediately coat the tip in fresh solder to prevent oxidation.